What We Offer

End-to-End ASIC
Design Services

From concept to tape-out — we own the full design flow so you can focus on your product. Or learn the flow yourself through our Design Academy.

For Companies

Design Services

Every service is delivered by engineers with production tape-out experience and a commitment to quality at every step.

RTL Design

We translate your specifications into precision RTL — synthesizable SystemVerilog and VHDL with clean coding practices, full lint compliance, and DFT awareness built in from the start. Deliverables include design specification, RTL source, synthesis scripts, and timing constraints.

SystemVerilog VHDL Lint-Clean DFT-Ready

Design Verification

Coverage-driven verification using the UVM methodology — block-level, subsystem, and SoC top-level testbenches with constrained-random stimulus, SystemVerilog assertions, and functional coverage closure. Formal verification for safety-critical or complex corner cases.

UVM Formal SVA Coverage

Physical Design

Full physical implementation from synthesis to sign-off-clean GDSII. Floorplanning, power planning, placement, CTS, routing, and timing closure using Synopsys and Cadence flows. Experienced in advanced nodes from 28nm to 3nm, with foundry DRC/LVS sign-off.

GDSII CTS STA DRC/LVS

IP Development

Reusable, process-tuned IP blocks — digital controllers, analog front ends, PHYs, and memory compilers — delivered with full characterization data, databooks, integration guides, and test benches. Available for targeted process nodes with performance and power guarantees.

Analog IP Digital IP SerDes PHY

Design Consulting

Independent architectural review, process node selection, feasibility analysis, and risk mitigation strategy. Ideal for teams at the beginning of a project who want experienced guidance before committing to an architecture or schedule.

Architecture Feasibility Risk Review

Post-Silicon Support

We don't stop at tape-out. Our team provides bringup support, debug assistance, and silicon characterization services to help you move from first silicon to production as quickly as possible.

Bringup Debug Characterization
How We Engage

Our Design Process

A structured, transparent engagement from first conversation to tapeout.

Discover

We learn your product goals, constraints, timeline, and process preferences — and identify risks early.

Design

Architecture agreement, RTL development, and verification — with weekly milestone reviews and full RTL sign-off.

Verify

Regression-passing testbenches, formal closure, and stress simulations. We don't proceed to physical design without confidence.

Deliver

DRC/LVS-clean GDSII, timing sign-off, full deliverable package — and ongoing support through bringup.

Results

Case Studies

Real projects. Real outcomes. Client names withheld under NDA.

16nm FinFET IoT / Wearables

Ultra-Low-Power IoT Microcontroller

A global IoT startup needed a custom MCU to replace a power-hungry FPGA prototype in a battery-powered wearable device.

Challenge Achieve 10× power reduction from FPGA baseline while maintaining processing performance for real-time sensor fusion.
Our Work Full ASIC design from architecture through GDSII — custom RTL, power-domain strategy, UVM verification, and physical design in TSMC 16nm.
Outcome 12× power improvement · First-pass silicon success · 6-month schedule met
28nm CMOS Medical Device

High-Speed Signal Processing ASIC

A medical device company needed a custom signal processing chip for a next-generation patient monitoring platform — with FDA submission requirements.

Challenge Design a safety-critical ASIC meeting DO-254 level B requirements, with mixed-signal integration and sub-1µW deep-sleep power.
Our Work Comprehensive design and verification with formal safety analysis, functional safety documentation, and foundry-qualified analog IP integration.
Outcome 10× power vs. prior FPGA · Zero critical silicon re-spins
Verification Block-Level

Verification: Subsystem Regression for Small ASIC

A small ASIC customer required targeted verification of a high-throughput data path to shorten debug cycles and reduce silicon risk.

Challenge Tight schedule to close functional coverage and reproduce intermittent corner-case failures seen in emulation.
Our Work Block-level UVM testbench, directed and constrained-random tests, formal checks on corner cases, and automation to reproduce failing scenarios on continuous integration.
Outcome Reduced debug cycle time by 60% · Coverage closure on critical features · Faster bring-up on silicon
RTL IP / Subsystem

Partial Design: High-Performance I/O Controller

We implemented and delivered a drop-in RTL I/O controller block for a client's SoC project — enabling the customer's team to focus on core differentiating logic.

Challenge Deliver a synthesizable, low-latency controller compatible with customer's bus and timing constraints.
Our Work RTL delivery, unit tests, integration scripts, and a lightweight UVM environment to validate timing and corner-case behavior.
Outcome Delivered as IP drop-in · Met timing with 1st synthesis pass · Shortened customer's integration schedule
For Talent

ChipLAB Design Academy

The Design Academy is a 24-week intensive program that takes motivated engineers from fundamentals to job-ready ASIC designer — using the same tools, flows, and standards as production chip design teams.

What We Do? We collaborate with governments, organizations, and universities across Africa, fostering a fertile environment for semiconductor technological growth.

Built and delivered by working engineers, not just instructors. You'll complete real design projects, receive personal code reviews, and graduate with a portfolio of work that hiring managers recognize immediately.

📅

24 Weeks

Part-time and full-time tracks available. Flexible schedule designed for working professionals.

🛠️

Real Tools

Synopsys VCS, Cadence Virtuoso, Genus, Innovus — the same EDA tools used in industry.

📋

Curriculum

SystemVerilog, UVM, Physical Design, STA, DFT, Low-Power Design, and Chip Entrepreneurship.

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Placement Support

Resume, portfolio, and interview preparation — plus introductions to our industry network.

Trainees

Trainee Testimonials

We seek not just to be a part of the global semiconductor industry, but to redefine it — bringing African talent to the forefront.

Trainee photo 1 ChipLAB's hands-on labs and code reviews accelerated my learning — I shipped meaningful RTL in week eight.

— Former Trainee

Trainee photo 2 The curriculum uses the same EDA tools I now use at work — the transition to a verification role was seamless.

— Former Trainee

Trainee photo 3 Mentorship and portfolio reviews helped me get interviews with top semiconductor teams.

— Former Trainee

News

Latest News

Recent announcements and coverage — read the full articles on our News page.

March 15, 2026

ChipLAB Completes Tape-out of Custom AI Inference Accelerator

Read more →
February 1, 2026

Design Academy Spring 2026 Cohort Now Enrolling

Read more →
January 10, 2026

ChipLAB Partners with Global Semiconductor Foundry

Read more →
Let's Build Together

Have a Project in Mind?

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